Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging
16.08.2024
Menlo Systems GmbH
Planegg
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Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging
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Planegg
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Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging
Planegg
Aktualität: 16.08.2024
Anzeigeninhalt:
16.08.2024, Menlo Systems GmbH
Planegg
Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging
Aufgaben:
Prototype thermal, electrical, and optical packaging solutions for chips
Develop the infrastructure and processes for the testing and packaging of optical chips at Menlo Systems
Work as part of a team on the realization of PIC-based light sources, such as frequency combs and supercontinua
Qualifikationen:
Completed university degree in the field of optical engineering, electrical engineering or physics
First professional experience as a development engineer for PIC, either in an industrial environment or equivalent experience, e.g., in the framework of a PhD
Knowledge and experience in at least two of the following areas: photonic integrated circuitry, packaging, electronics, mechanical design, laser physics, photonics
Communication and teamwork skills with a high degree of initiative and persuasiveness
Good knowledge of written and spoken German and English
Berufsfeld
Bundesland
Standorte